TSMC plans to build its 2nm wafer fab in Hsinchu, where land has already been obtained for the facility, according to YP Chin, senior vice president for operations at the foundry house.

Time for largest marketing hoax.

TSMC started to lie

Attacking Huawei had one big reason - otherwise Apple couldn't get enough A14 LSI's made.

But new slides data and strange situation with 7nm+ process that fully disappeared from all marketing materials and slides, not good.

Initial TSMC plans on 5nm had been:

• Production of both Xbox and Playstation LSI already in 2020, now shifted to 2022
• Production of Huawei LSI - cancelled due to TSMC request to US
• Production of Apple A14 LSI - will be only big client using 5nm this year, but production is halved from initial numbers via delays and few other tricks
• Production of AMD Zen 3 CPUs - production shifted to 2022, may be to Zen 4 or even Zen 5
• Production of Nvidia new top GPU - production moved to Samsung factories

TSMC has already scaled up its 7nm process output to 130,000 wafers monthly ahead of schedule, with the monthly production set to climb further to 140,000 units at the end of this year, according to industry sources.

Yet Nvidia had been forced to use much worse Samsung process.

New cooling ideas

Intel 7nm problems seems to be severe

JPMorgan Chase analysts said that Intel is preparing for the new chip early. Based on this calculation, TSMC will start mass production of Intel's central processing unit (CPU) in the first half of 2022, six to twelve months earlier than expected.

Analysts said that before the mass production of Intel's 5nm chip, TSMC still has the opportunity to win Intel Xe GPU and chipset orders, using the same advanced 7nm and 6nm technologies.

All new Apple smartphones will start to use heatpipes

Due to problems with lowering thermal performance while going to 5nm and further to 3nm (despite TSMC and Samsung claims) Apple will be forced to significantly update thermal performance of their designs.

Two solutions are expected - use of metal in the rear casing and use up to 3 heatpipes to spread the abnormal heat from central processor LSI.

Non throttling performance can drop to mere 3-4 minutes for 2021 flagmans, causing LSI to drop performance by 40-50%.

Something bad is happening with TSMC last months

Sony Corp. has cut its estimated PlayStation 5 production for this fiscal year by 4 million units, down to around 11 million, following production issues with its custom-designed system-on-chip for the new console.

Company has come up against manufacturing issues, such as production yields as low as 50% for its SOC, which have cut into its ability to produce as many consoles as it wishes, said the people, who asked to remain anonymous because the deliberations aren’t public. Yields have been gradually improving but have yet to reach a stable level, they added.

Rumor is that Sony placed bet on so called 7nm+ process with EUV usage and this is reason of all issues.

As TSMC cancelled its usage in all AMD chiplets adn all other major orders and now reason is clear.

If this personal attacks are true, it will be beyond repair indeed.

What strikes me is the relaxed position of USA fucking up china In the licensees but having china make them all it’s high tech stuff.

Let’s wait and see the complexes problems this party’s will have sooner than later

I feel it will be historic news.

Quite weird table if do not know that it is

From https://cset.georgetown.edu/research/ai-chips-what-they-are-and-why-they-matter/

It is actually about some abstract big AI chips (610 mm2, 90.7 billion transistors at 148.2 MTr/mm2), but about real CPUs or GPUs that changes with process.

And all numbers are estimates, as making real numbers public could shock the public, so it won't be allowed no matter that.

TSMC sells a 300mm wafer processed using its N5 technology for about $16,988. By contrast, the world’s largest contract maker of semiconductors charges around $9,346 per 300mm wafer patterned using its N7 node as well as $3,984 for a 300mm wafer fabbed using its 16nm or 12nm technology.

As chip makers have reached the limits of atomic-scale circuitry and the physics of electrons, Moore’s law has slowed, and some say it’s over. But a different law, potentially no less consequential for computing’s next half century, has arisen.

I call it Huang’s Law, after Nvidia Corp. chief executive and co-founder Jensen Huang. It describes how the silicon chips that power artificial intelligence more than double in performance every two years. While the increase can be attributed to both hardware and software, its steady progress makes it a unique enabler of everything from autonomous cars, trucks and ships to the face, voice and object recognition in our personal gadgets.

Between November 2012 and this May, performance of Nvidia’s chips increased 317 times for an important class of AI calculations, says Bill Dally, chief scientist and senior vice president of research at Nvidia. On average, in other words, the performance of these chips more than doubled every year, a rate of progress that makes Moore’s Law pale in comparison.

https://www.wsj.com/articles/huangs-law-is-the-new-moores-law-and-explains-why-nvidia-wants-arm-11600488001

Tragedy is that energy per each performance unit is no longer dropping much.

Sony and Microsoft’s new-generation game consoles are expected to be out of stock until mid-2021. In second half availability will slowly improve.

The quantity of ordered wafers is as high as 102,000, and the recent yield rate is estimated to reach 58%, and TSMC wants to it improve significantly after the fourth quarter.