Taiwan as part of criminal plot

Revenue from the export of integrated circuits and semiconductor stuff in June reached a record high. China and the United States remained the most loaded export destinations, demonstrating an increase in profile revenues by 37.8 and 34.5% compared to the previous year's level, respectively.

Total exports revenue of Taiwan across all industries in June grew by 35.1% year-on-year to $ 36.7 billion, which is already the second highest value on record. Import revenue increased by 42.3% to $ 31.5 billion, the foreign trade balance increased to $ 5.2 billion compared to last year.

All we saw is planned crime that involved mass media and top leading corporations and banks.

TSMC is gearing up for a bigger presence in the automotive IC foundry market segment, with its newly-developed N5A process set to be available in the third quarter of 2022, according to industry sources.

TSMS PR expenses are now highest ever, and soon you will be watching how for hundreds of millions of marketing TSMC will be selling you old 7nm as newest 4nm process.

In China things are not so bad

Globalfoundries (GF) has announced expansion plans for its most advanced manufacturing facility in upstate New York over the coming years. These plans include immediate investments to address the global chip shortage at its existing Fab 8 facility as well as construction of a new fab on the same campus that will double the site's capacity.

GF said it will invest US$1 billion to immediately add an additional 150,000 wafers per year within its existing fab to help address the global chip shortage.

Big price hikes had been required for this.

Company also is getting ready for merger with Intel.

Intel is forced to reduce huge Xeon margins

Intel officially declared that it is now marketing that reduces "nanometers"

Future Intel products (from 12th Gen Alder Lake) will no longer use the nanometer-based node nomenclature that both it and the rest of the chipmaking industry has used for years.

Intel is debuting a new naming scheme that it says will provide “a more accurate view of process nodes across the industry” and how Intel’s products fit into that landscape.

Third-generation 10nm chips will be referred to as “Intel 7,” instead of getting some 10nm-based name.

• Intel 7 (formerly Intel 10nm Enhanced SuperFIN technology) - will provide an increase in performance per watt of about 10-15% compared to Intel 10nm SuperFin by optimizing the structure of FinFET transistors. The technology will be used in the production of Alder Lake processors due this year and Sapphire Rapids server chips, which will begin shipping in the first quarter of 2022.
• Intel 4 (formerly Intel 7nm) - Will provide about 20% improvement in performance per watt along with further increases in transistor density and the introduction of EUV lithography. Intel 4 will debut in the second half of 2022 and will be used in Meteor Lake client processors and Granite Rapids server processors due in 2023.
• Intel 3 - Delivers about 18% performance per watt gain over Intel 4, leveraging further FinFET optimizations and enhanced EUV lithography. Intel 3 is expected to be ready for mass production in the second half of 2023.
• Intel 20A - will be the first Intel process technology with the dimension of transistors in angstroms. The Intel 20A is expected to launch in 2024.
• Intel 18A - slated for early 2025. At this stage, Intel intends to implement High NA EUV lithography, for which the company is partnering with ASML.

https://www.theverge.com/2021/7/26/22594074/intel-acclerated-new-architecture-roadmap-naming-7nm-2025

The Dutch company ASML reported its work in the second quarter of calendar 2021. The world's only manufacturer of advanced lithographic scanners for the production of chips sees a sharp and steady increase in demand for its products.

The speculations and total monopoly helped ASML increase its quarterly revenue and bottom line. Orders for lithographic equipment rose 75% quarter-on-quarter to 8.3 billion euros ($ 9.78 billion), and the company's net profit rose 38% to 1 billion euros ($ 1.17 billion).

ASML is now becoming biggest hurdle on he road of progress.

Having already raised its quotes for 28nm process technology, TSMC has moved to maintain the prices throughout the second half of this year, according to industry sources.

Criminals.

TSMC is on track to move its 3nm process technology to volume production in the second half of 2022 for Apple's devices, either iPhones or Mac computers, according to industry sources.

3nm is the last marketing step before long pause.

Apple has been TSMC's largest client, with its chip orders for the iPhone, iPad and Apple Watch continuing to account for more than 20% of the foundry's total wafer revenue, according to industry sources.

Interesting info.

Samsung Electronics is unlikely to move its 3nm gate-all-around (GAA) FET technology to volume production until 2023.

In reality they have staggering issues with their present best process still.

Another hikes coming

United Microelectronics (UMC) has notified clients prices for its 28nm and 22nm process manufacturing will be adjusted upward in September, November and January 2022

TSMC is poised to raise its quotes including those for advanced sub-7nm process technologies, which will result in more manufacturing costs facing Apple and other major clients, according to industry sources.

Nicer.