Bad design: Chip-on-Wafer-on-Substrate packaging for modern chips
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This is real disaster waiting to happen, as such construction behaviour is very complex during thermal stresses, probability of failure (lack of contact in any of small balls) is around 10x more compared to ordinary modern chips package. And with age it'll rise very fast. Completely unrepairable.
sa12738.jpg736 x 265 - 40K
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