Personal View site logo
Make sure to join PV on Telegram or Facebook! Perfect to keep up with community on your smartphone.
Please, support PV!
It allows to keep PV going, with more focus towards AI, but keeping be one of the few truly independent places.
Bad design: Chip-on-Wafer-on-Substrate packaging for modern chips
  • Vitaliy_KiselevVitaliy_Kiselev

    image

    This is real disaster waiting to happen, as such construction behaviour is very complex during thermal stresses, probability of failure (lack of contact in any of small balls) is around 10x more compared to ordinary modern chips package. And with age it'll rise very fast. Completely unrepairable.

    sa12738.jpg
    736 x 265 - 40K
Add a Comment