Samsung Electronics is going to start mass-producing ‘3-layered image sensor’ in November. This image sensor is made into a layered structure by connecting a system semiconductor (logic chip) that is in charge of calculations and DRAM chip that can temporarily store data through TSV (Through Silicon Via) technology. Samsung Electronics currently ordered special equipment for mass-production and is going to start mass-producing ‘3-layered image sensor’ after doing pilot operation in next month.

SONY established a batch process system that attaches a sensor, a DRAM chip, and a logic chip in a unit of a wafer. On the other hand, it is understood that Samsung Electronics is using a method that makes 2-layered structure with a sensor and a logic chip and attaches DRAM through TC (Thermal Compression) bonding method after flipping over a wafer. From productivity and production cost, SONY has an upper hand. It seems that a reason why Samsung Electronics decided to use its way is because it wanted to avoid using other patents.

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