"The dual camera module size is 21.0 mm x 10.6 mm x 6.3 mm thick. Based on our initial X-rays it appears the wide-angle camera uses optical image stabilization (OIS), while the telephoto camera does not (the same configuration as iPhone 7 Plus).

The wide-angle Sony CIS has a die size of 6.29 mm x 5.21 mm (32.8 mm2). This compares to a 32.3 mm2 die size for iPhone 7’s wide-angle CIS.

We do note a new Phase Pixel pattern, but the big news is the absence of surface artifacts corresponding to the through silicon via (TSV) arrays we’ve seen for a few years. A superficial review of the die photo would suggest it’s a regular back-illuminated (BSI) chip. However, we’ve confirmed it’s a stacked (Exmor RS) chip which means hybrid bonding is in use for the first time in an Apple camera!"

http://www.techinsights.com/about-techinsights/overview/blog/apple-iphone-8-teardown/